JOB RESPONSIBILITIES

-  TIM (TIM1, TIM1.5 and TIM2) and derived thermally conductive product development.
-  Fundamental study on heat dissipation mechanism on microscopic interface and correlation between component and performance.
-  Technology innovation to keep up with macro emerging application.
-  Collaboration with process and production team to scale up formulation and mass production. 
-  Visit customers with commercial team together to define CTQs and conduct technical feasibility.
-  Conduct experiment DOE and related performance testing.
-  Project management in whole stream and collaborate with related functions to commercialize formulation.
-  Benchmark the CoProducers' TIM related products.
-  Maintain and develop current company intelligence for value creation.
-  Actively monitor relevant local IP landscape and strengthen company IP position.
-  Maintain samples, chemical substances, technical equipment, furniture and operational procedures in lab.
-  Meeting the requirements of IMS/ISO and EHSS standards.
-  Understand IATF 16949 related requirements; provide customers with products and services that meet requirements in accordance with legal and regulatory, customers and internal product development processes.

REQUIRED QUALIFICATION

-  Ph.D in Polymer, Chemistry or Material Science is preferred, exceptionally outstanding Master's degree may also be considered.
-  Strong expertise in polymer and silicone chemistry preferred (Thermal Curable, RTV-2 Hydrosilylation, RTV-1 Condensation).
-  The candidates with expertise in semiconductor adhesive (silicone, epoxy, acrylic, BMI etc. related ) will be a plus.
Knowledge/Requirement

-  Solid knowledge of powder, electronic adhesive and TIM (silicone-based or non-silicone-based) preferred.
-  Strong knowledge of silicone, acrylic, epoxy, polyurethane, MS based adhesive.
-  Strong expertise in formulation development for electronics.
-  Familiar with filler treatment know-how particularly thermal conductive filler.
-  Familiar with the R&D and IP procedures.
-  Good cross-function communication and teamwork ability.
-  Fluent command of written and spoken English.
-  Good IT skills (MS Windows, MS Office, MS Outlook).
Soft skills: 
-  Systematic thinking, open-minded, pro-active, communicational and team workable personality including intercultural competence.
Experience

-  At least 5-year related working experience in TIM and/or adhesive applications of semiconductor, data center, AI, consumer electronics, telecommunication, e-mobility or photovoltaic and so on.
-  ph.D is preferred, and senior level master with strong experience is acceptable.